This chip is renowned for its , ultra-low distortion, and high signal-to-noise ratio (SNR). It was featured in many audiophile-grade smartphones such as the LG G6, LG V30, Xiaomi Mi 6, and Google Pixel 2 XL.
The full NDA-protected datasheet (e.g., 80-NL713-XX) contains register maps and timing diagrams not publicly available. This review synthesizes information from authorized summary datasheets, developer blogs, and reverse-engineering community insights as of 2026.
The WCD9341 had transformed from a mysterious datasheet entry into a legendary component, cherished by electronics enthusiasts worldwide. And Emma's retro gaming console? It became a beloved showcase for the WCD9341's capabilities, inspiring others to push the boundaries of what was possible with creative engineering and a dash of curiosity.
Future work on the WCD9341 may include:
Integrated low-noise microphone bias (MICBIAS) generators provide clean, regulated DC voltage to external electret or MEMS microphones. Audio Processing Core
The is more than a technical document; it is a roadmap to mobile audio excellence. While obtaining the full document requires legal agreements with Qualcomm, the publicly available specifications confirm that this codec remains a benchmark for high-fidelity portable audio.
The Qualcomm Aqstic WCD9341 Go to product viewer dialog for this item.
The datasheet separates the WCD9341 into several critical internal subsystems: Audio Processing Subsystem
: Apply professional-grade BGA flux around the chip. Heat the area to approximately 350°C to 380°C using a hot air station, then lift the IC with tweezers.
The is an advanced High-Fidelity (Hi-Fi) audio codec developed by Qualcomm , operating under their Aqstic brand umbrella. Its primary function is to convert digital audio streams into high-quality analog signals (DAC) and vice-versa (ADC). Designed specifically to be paired with high-end Snapdragon mobile processors, the WCD9341 was built to rival even dedicated, branded audiophile DACs by offering objectively better objective measurements and performance. 2. Key Specifications and Technical Highlights
+----------------------------------+ +------------------------+ | Qualcomm Snapdragon SoC | | WCD9341 Audio Codec | | | | | | +----------------------------+ | SLIMbus | +------------------+ | | | Audio DSP / Audio HAL |==|==========|==| Digital Audio I/F| | | +----------------------------+ | | +------------------+ | | | | || | +----------------------------------+ | +------------------+ | | | DACs / Amps / ADCs| | | +------------------+ | +------------------------+ || +------------------------+ | Headphone Jack / Mics | +------------------------+ Hardware Design Considerations
: No audio from the bottom speaker, earpiece, or wired headphones.
Small footprint, ideal for densely packed flagship smartphone motherboards. 4. WCD9341 Applications & Compatibility
| Pin Group | Function | Key Pins | |-----------|----------|-----------| | Analog Inputs | MIC Bias, Line-in, Headset Mic | MICBIAS1, MICBIAS2, IN1P/N, IN2P/N | | Analog Outputs | HPH L/R, Line-out, Earpiece | HPH_L, HPH_R, LINEOUT_L/R, EAR_P/N | | Digital Audio | I2S, PCM, TDM | I2S_BCLK, I2S_LRCLK, I2S_DIN, I2S_DOUT | | Control | I2C (Slave) | I2C_SCL, I2C_SDA | | Power | Supply rails | VDD_IO (1.8V), VDD_A (1.8V), VDD_D (0.9V) | | Clock | Master clock | MCLK (19.2 MHz, 24 MHz, or 38.4 MHz) |
Discover more from Capital Buildcon
Subscribe now to keep reading and get access to the full archive.
Continue reading
Wcd9341 Datasheet - Patched
This chip is renowned for its , ultra-low distortion, and high signal-to-noise ratio (SNR). It was featured in many audiophile-grade smartphones such as the LG G6, LG V30, Xiaomi Mi 6, and Google Pixel 2 XL.
The full NDA-protected datasheet (e.g., 80-NL713-XX) contains register maps and timing diagrams not publicly available. This review synthesizes information from authorized summary datasheets, developer blogs, and reverse-engineering community insights as of 2026.
The WCD9341 had transformed from a mysterious datasheet entry into a legendary component, cherished by electronics enthusiasts worldwide. And Emma's retro gaming console? It became a beloved showcase for the WCD9341's capabilities, inspiring others to push the boundaries of what was possible with creative engineering and a dash of curiosity.
Future work on the WCD9341 may include:
Integrated low-noise microphone bias (MICBIAS) generators provide clean, regulated DC voltage to external electret or MEMS microphones. Audio Processing Core
The is more than a technical document; it is a roadmap to mobile audio excellence. While obtaining the full document requires legal agreements with Qualcomm, the publicly available specifications confirm that this codec remains a benchmark for high-fidelity portable audio.
The Qualcomm Aqstic WCD9341 Go to product viewer dialog for this item. wcd9341 datasheet
The datasheet separates the WCD9341 into several critical internal subsystems: Audio Processing Subsystem
: Apply professional-grade BGA flux around the chip. Heat the area to approximately 350°C to 380°C using a hot air station, then lift the IC with tweezers.
The is an advanced High-Fidelity (Hi-Fi) audio codec developed by Qualcomm , operating under their Aqstic brand umbrella. Its primary function is to convert digital audio streams into high-quality analog signals (DAC) and vice-versa (ADC). Designed specifically to be paired with high-end Snapdragon mobile processors, the WCD9341 was built to rival even dedicated, branded audiophile DACs by offering objectively better objective measurements and performance. 2. Key Specifications and Technical Highlights This chip is renowned for its , ultra-low
+----------------------------------+ +------------------------+ | Qualcomm Snapdragon SoC | | WCD9341 Audio Codec | | | | | | +----------------------------+ | SLIMbus | +------------------+ | | | Audio DSP / Audio HAL |==|==========|==| Digital Audio I/F| | | +----------------------------+ | | +------------------+ | | | | || | +----------------------------------+ | +------------------+ | | | DACs / Amps / ADCs| | | +------------------+ | +------------------------+ || +------------------------+ | Headphone Jack / Mics | +------------------------+ Hardware Design Considerations
: No audio from the bottom speaker, earpiece, or wired headphones.
Small footprint, ideal for densely packed flagship smartphone motherboards. 4. WCD9341 Applications & Compatibility It became a beloved showcase for the WCD9341's
| Pin Group | Function | Key Pins | |-----------|----------|-----------| | Analog Inputs | MIC Bias, Line-in, Headset Mic | MICBIAS1, MICBIAS2, IN1P/N, IN2P/N | | Analog Outputs | HPH L/R, Line-out, Earpiece | HPH_L, HPH_R, LINEOUT_L/R, EAR_P/N | | Digital Audio | I2S, PCM, TDM | I2S_BCLK, I2S_LRCLK, I2S_DIN, I2S_DOUT | | Control | I2C (Slave) | I2C_SCL, I2C_SDA | | Power | Supply rails | VDD_IO (1.8V), VDD_A (1.8V), VDD_D (0.9V) | | Clock | Master clock | MCLK (19.2 MHz, 24 MHz, or 38.4 MHz) |